Today we reported results for the second quarter of fiscal 2026. Check out this snapshot to learn more about our financial results and business highlights. Head to our link in bio to learn more.
Applied Materials has announced that @arizonastateuniversity , @rpiofficial and @stanfordeng will join the company’s EPIC Center in Silicon Valley as inaugural research partners. Through close collaboration with Applied’s scientists and engineers, university teams will engage in high velocity research programs across advanced materials, novel process and device technologies, and chip architecture inflections – leveraging the synergy of academia and industry to accelerate energy efficient innovations for next generation AI chips.
“The EPIC Center is designed to bring together the best minds from industry and academia in a high velocity, manufacturing relevant environment to dramatically accelerate the development and commercialization of next generation semiconductor technologies that are foundational to AI computing,” said Gary Dickerson, President and CEO of Applied Materials. “Welcoming ASU, RPI and Stanford as research partners at EPIC strengthens the U.S. lab to fab innovation pipeline and creates a powerful platform for developing future semiconductor talent.”
Learn more through the link in bio
Today Applied Materials announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data center to the edge.
“Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” said Gary Dickerson, President and CEO of Applied Materials. “By bringing our teams together at the EPIC Center, we are strengthening that partnership and accelerating the development of technologies to address the unprecedented complexity driving the chipmaking roadmap.”
Link in bio to learn more.
Copper has been the interconnect metal of choice in the industry for many years. To achieve all the steps that make up modern copper wires, Applied developed a multi-step copper barrier seed process on the Endura platform. This is one of the many ways our teams at Applied deliver material innovation that impact the semiconductor industry each and every day. #MakeItMaterial
At Applied Materials, careers are built through transformative innovation and global collaboration. Alice’s journey reflects how working across regions and disciplines enables our teams to share knowledge and solve the semiconductor industry’s most critical challenges. Here, your work delivers real-world impact and positions you for long-term success.
Today we announced we have entered into a definitive agreement with ASMPT SEMI Solutions to acquire its ASMPT NEXX, Inc. business, a leading supplier of large-area advanced packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of panel-level advanced packaging technologies which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance. Learn more through the link in bio.
In our recent Leading the Future of Logic Master Class, we explain that as AI chip designers move to new 3D transistor architectures, wiring increases right along with transistor scaling and density. Be sure to watch the whole video to learn the mind-blowing numbers about transistors and wiring in leading edge AI GPUs. How is this possible? With the amazing material innovation from our team across the entire wiring stack. #MakeItMaterial
As AI drives demand for faster, more energy‑efficient chips, transistor customization is becoming just as important as scaling. The Applied Materials Trillium™ system enables chipmakers to precisely engineer materials at the atomic level, allowing transistor performance to be tuned for specific AI workloads. By combining advanced deposition, integration and process control in a single platform, Trillium helps speed development of next‑generation devices while delivering better power, performance and yield at leading‑edge nodes - a key step toward more flexible, application‑optimized semiconductors in the AI era.
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#makeitmaterial
We are seeing a rapid shift from concepts to execution in AI and robotics. AI is not just a feature anymore. It’s the default layer across devices and systems. And at the foundation is the materials engineering expertise from Applied Materials that is advancing technology and enabling the AI era. #MakeItMaterial
Want to learn more about Applied's material innovation in transistors but missed our recent Leading the Future of Logic Master Class? Watch this video where we describe how shallow trench isolation enables increased transistor speed and power efficiency. #MakeItMaterial
Today we announced that Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster. To support this partnership, Advantest has established a new, state-of-the-art Innovation Center on Applied Materials’ R&D campus in Silicon Valley, that will seamlessly connect with Applied’s EPIC Center.
“Applied Materials designed the EPIC platform to dramatically accelerate the commercialization of next-generation semiconductors by co-locating and co-innovating with our customers and partners,” said Gary Dickerson, President and CEO of Applied Materials. “By collaborating side-by-side with Advantest, we can develop solutions that enable chipmakers to optimize end-to-end semiconductor production flows and bring new designs to market faster and more efficiently.”
Head to the bio to learn more about the partnership.
Welcome back to Applied’s semiconductor chip city where we talk about how each piece of the city works together to make a real, meaningful difference. Today we introduce to you to Kinex, the hybrid bonding foreman within our semiconductor chip city. 🧱 Stacking chiplets with atomic precision and building the backbone of tomorrow’s AI, Kinex is Applied’s fully integrated hybrid bonding system, purpose built for high volume manufacturing environments. Learn more about Kinex by visiting our link in bio.
We deliver material innovation that changes the world. #MakeItMaterial
